In the present work we investigate photo-detectors based on thick relaxed Ge layers, epitaxially grown on silicon after insertion of a low-temperature-grown Ge buffer layer. By using this procedure it was possible to grow films having thicknesses comparable with light penetration depth in the 1.3-1.6 μm spectral range. The films exhibited flatness on the atomic scale. Two kinds of detectors were investigated: vertical heterojunction diodes and a planar Metal-Semiconductor-Metal structure. The detectors show a good responsivity at normal incidence at both 1.3 and 1.55 μm. The photocurrent increases with the voltage applied, reaching a maximum responsivity of 0.24 A/W at 1.3 μm under a bias of 1 V. A complete optoelectronic characterization of the fabricated devices is performed. The results confirm the feasibility of the proposed approach for the fabrication of 1.3-1.55 μm near infrared photodetectors integrated on silicon chips.

Colace, L., Masini, G., Galluzzi, F., Assanto, G., Capellini, G., DI GASPARE, L., et al. (1998). Near infrared light detectors based on UHV-CVD epitaxial Ge on Si (100). MATERIALS RESEARCH SOCIETY SYMPOSIA PROCEEDINGS, 486, 193-198.

Near infrared light detectors based on UHV-CVD epitaxial Ge on Si (100)

ASSANTO, GAETANO;DI GASPARE, LUCIANA;
1998-01-01

Abstract

In the present work we investigate photo-detectors based on thick relaxed Ge layers, epitaxially grown on silicon after insertion of a low-temperature-grown Ge buffer layer. By using this procedure it was possible to grow films having thicknesses comparable with light penetration depth in the 1.3-1.6 μm spectral range. The films exhibited flatness on the atomic scale. Two kinds of detectors were investigated: vertical heterojunction diodes and a planar Metal-Semiconductor-Metal structure. The detectors show a good responsivity at normal incidence at both 1.3 and 1.55 μm. The photocurrent increases with the voltage applied, reaching a maximum responsivity of 0.24 A/W at 1.3 μm under a bias of 1 V. A complete optoelectronic characterization of the fabricated devices is performed. The results confirm the feasibility of the proposed approach for the fabrication of 1.3-1.55 μm near infrared photodetectors integrated on silicon chips.
1998
Colace, L., Masini, G., Galluzzi, F., Assanto, G., Capellini, G., DI GASPARE, L., et al. (1998). Near infrared light detectors based on UHV-CVD epitaxial Ge on Si (100). MATERIALS RESEARCH SOCIETY SYMPOSIA PROCEEDINGS, 486, 193-198.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11590/123085
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