In the present study, residual stress evaluation in thin films was achieved using a semi-destructive trench-cutting method. Focused Ion Beam (FIB) was employed to introduce the strain relief by ring-core milling, i.e. creating a trench around an "island". Either SEM or FIB imaging can be used to record sequences of images for strain change evaluation by Digital Image Correlation (DIC) analysis of micrographs. A regular array of shallow holes was drilled on a thin overlayer of Pt (∼100nm) deposited on to the film prior to patterning and trenching, in order to reduce the damage introduced by the ion beam during imaging and to assist the DIC strain evaluation by adding traceable markers. Finite Element (FE) simulation was also carried out to predict the curves for strain relief as a function of milling depth, and compared with the experimental measurements, which show good agreement with each other. An empirical mathematical description of the curves was proposed that allows efficient residual stress evaluation in thin solid films. © 2011 Published by Elsevier Ltd.
Song, X., Yeap K., B., Zhu, J., Belnoue, J., Sebastiani, M., Bemporad, E., et al. (2011). Residual stress measurement in thin films using the semi-destructive ring-core drilling method using Focused Ion Beam. In Proceedings of 11th International Conference on the Mechanical Behavior of Materials, ICM11; Como; Italy; 5 June - 9 June 2011; Code 86584 (pp.2190-2195) [10.1016/j.proeng.2011.04.362].
Residual stress measurement in thin films using the semi-destructive ring-core drilling method using Focused Ion Beam
SEBASTIANI, MARCO;BEMPORAD, Edoardo;
2011-01-01
Abstract
In the present study, residual stress evaluation in thin films was achieved using a semi-destructive trench-cutting method. Focused Ion Beam (FIB) was employed to introduce the strain relief by ring-core milling, i.e. creating a trench around an "island". Either SEM or FIB imaging can be used to record sequences of images for strain change evaluation by Digital Image Correlation (DIC) analysis of micrographs. A regular array of shallow holes was drilled on a thin overlayer of Pt (∼100nm) deposited on to the film prior to patterning and trenching, in order to reduce the damage introduced by the ion beam during imaging and to assist the DIC strain evaluation by adding traceable markers. Finite Element (FE) simulation was also carried out to predict the curves for strain relief as a function of milling depth, and compared with the experimental measurements, which show good agreement with each other. An empirical mathematical description of the curves was proposed that allows efficient residual stress evaluation in thin solid films. © 2011 Published by Elsevier Ltd.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
