MVMS-based Capacitive Micromachined Ultrasonic Transducer (CMUT) technology enables the development of advanced transducer-electronics integrated multi-chip modules (MCM) for medical imaging applications. In this pajer, we present the design, fabrication and characterization of a 256-element CMUT spiral array integrated with a 256-channel analog front end (AFE) ASIC featuring high-voltage unipolar pulsers, low-noise amplifiers and a programmable transmit beamformer. The spiral array, designed to perform volumetric beam steering at 7 MHz, is characterized by a c density-tapered layout of 220μm-wide hexagonal elements distributed over a quasi-circular area of 10 mm diameter. The CMUT and the AFE were co-designed, fabricated and interconnected through an acoustically optimized 3-D packaging method. The resulting MCM was electromechanically and acoustically characterized, demonstrating the potential of the proposed approach for integrated 2-D CMUT array fabrication.
Savoia, A.S., Boni, E., Sautto, M., Quaglia, F., Mauti, B., Ramalli, A., et al. (2018). A 256-element spiral CMUT array with integrated analog front end and transmit beamforming circuits. In IEEE International Ultrasonics Symposium, IUS (pp.206-212). IEEE Computer Society [10.1109/ULTSYM.2018.8579867].
A 256-element spiral CMUT array with integrated analog front end and transmit beamforming circuits
Savoia, Alessandro Stuart
;Mauti, Barbara;Caliano, Giosué;Tortoli, Piero
2018-01-01
Abstract
MVMS-based Capacitive Micromachined Ultrasonic Transducer (CMUT) technology enables the development of advanced transducer-electronics integrated multi-chip modules (MCM) for medical imaging applications. In this pajer, we present the design, fabrication and characterization of a 256-element CMUT spiral array integrated with a 256-channel analog front end (AFE) ASIC featuring high-voltage unipolar pulsers, low-noise amplifiers and a programmable transmit beamformer. The spiral array, designed to perform volumetric beam steering at 7 MHz, is characterized by a c density-tapered layout of 220μm-wide hexagonal elements distributed over a quasi-circular area of 10 mm diameter. The CMUT and the AFE were co-designed, fabricated and interconnected through an acoustically optimized 3-D packaging method. The resulting MCM was electromechanically and acoustically characterized, demonstrating the potential of the proposed approach for integrated 2-D CMUT array fabrication.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
