Tin doped indium oxide (ITO) coatings have been deposited on epoxy resin and glass substrates by low tem-perature (70 °C) RF magnetron sputtering. Influence of different process parameters on coating morphologicaland electrical properties has been studied. Epoxy resin surface roughness influence on coating microstructurewas also investigated. We have found that: (i) deposition chamber oxygen content is the main parameter af-fecting surface electrical resistance, (ii) microstructure and electrical properties are similar in both glass andpolymeric smooth substrates; in the latter the substrate stability (type of polymer and degree of cure) is im-portant to prevent microcracks formation as a result of stress release after deposition, and (iii) rough substratespresent a non-uniform microstructures with formation of clusters of crystallites with various orientation.
Bragaglia, M., Lamastra, F.R., Tului, M., Di Gaspare, L., Notargiacomo, A., Valentini, M., et al. (2019). Low temperature sputtered ITO on glass and epoxy resin substrates:influence of process parameters and substrate roughness on morphologicaland electrical properties. SURFACES AND INTERFACES, 17, 100365 [10.1016/j.surfin.2019.100365].
Low temperature sputtered ITO on glass and epoxy resin substrates:influence of process parameters and substrate roughness on morphologicaland electrical properties
L. Di GaspareMembro del Collaboration Group
;A. NotargiacomoMembro del Collaboration Group
;
2019-01-01
Abstract
Tin doped indium oxide (ITO) coatings have been deposited on epoxy resin and glass substrates by low tem-perature (70 °C) RF magnetron sputtering. Influence of different process parameters on coating morphologicaland electrical properties has been studied. Epoxy resin surface roughness influence on coating microstructurewas also investigated. We have found that: (i) deposition chamber oxygen content is the main parameter af-fecting surface electrical resistance, (ii) microstructure and electrical properties are similar in both glass andpolymeric smooth substrates; in the latter the substrate stability (type of polymer and degree of cure) is im-portant to prevent microcracks formation as a result of stress release after deposition, and (iii) rough substratespresent a non-uniform microstructures with formation of clusters of crystallites with various orientation.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
