In recent years, the Cyber-Physical Systems (CPSs), have become a new trend to increase and to enrich the interactions between physical and virtual systems with the goal to create a truly connected world in which smart objects interact and exchange data with each other. The CPS is the core of the new industrial revolution called 'Industry 4.0', which promotes the computerization of manufacturing to make decentralized decisions. Within the modular structured smart factories, Cyber-Physical Systems monitor physical processes, create a virtual copy of the physical world, simulate parts of process and implement sophisticated control policies in order to take optimized decisions. This research proposes the modelling and simulation of an induction heating process for aluminium-steel mold, which is used in the production of footwear soles. The modelling supports the simulation of a CPS model related to the use of a multi-use LGV (Laser Guided Vehicle) which transports aluminum-steel molds from a mechanized warehouse to the final rotary production line, used for the soles foaming. In detail, a thermal model and an induction heating electronic circuit model have been studied to describe the whole mold heating system and they have been simulated using Simulink/MATLAB. In addition, two types of controllers, an induction preheating control technique based on a Model Predictive Controller (MPC), and another one based on PID, have been developed in order to analyse the different behaviour of the system.

Cicconi, P., Russo, A.C., Germani, M., Prist, M., Pallotta, E., & Monteriu, A. (2017). Cyber-physical system integration for industry 4.0: Modelling and simulation of an induction heating process for aluminium-steel molds in footwear soles manufacturing. In RTSI 2017 - IEEE 3rd International Forum on Research and Technologies for Society and Industry, Conference Proceedings (pp.1-6). Institute of Electrical and Electronics Engineers Inc. [10.1109/RTSI.2017.8065972].

Cyber-physical system integration for industry 4.0: Modelling and simulation of an induction heating process for aluminium-steel molds in footwear soles manufacturing

Cicconi P.;
2017

Abstract

In recent years, the Cyber-Physical Systems (CPSs), have become a new trend to increase and to enrich the interactions between physical and virtual systems with the goal to create a truly connected world in which smart objects interact and exchange data with each other. The CPS is the core of the new industrial revolution called 'Industry 4.0', which promotes the computerization of manufacturing to make decentralized decisions. Within the modular structured smart factories, Cyber-Physical Systems monitor physical processes, create a virtual copy of the physical world, simulate parts of process and implement sophisticated control policies in order to take optimized decisions. This research proposes the modelling and simulation of an induction heating process for aluminium-steel mold, which is used in the production of footwear soles. The modelling supports the simulation of a CPS model related to the use of a multi-use LGV (Laser Guided Vehicle) which transports aluminum-steel molds from a mechanized warehouse to the final rotary production line, used for the soles foaming. In detail, a thermal model and an induction heating electronic circuit model have been studied to describe the whole mold heating system and they have been simulated using Simulink/MATLAB. In addition, two types of controllers, an induction preheating control technique based on a Model Predictive Controller (MPC), and another one based on PID, have been developed in order to analyse the different behaviour of the system.
978-1-5386-3906-1
Cicconi, P., Russo, A.C., Germani, M., Prist, M., Pallotta, E., & Monteriu, A. (2017). Cyber-physical system integration for industry 4.0: Modelling and simulation of an induction heating process for aluminium-steel molds in footwear soles manufacturing. In RTSI 2017 - IEEE 3rd International Forum on Research and Technologies for Society and Industry, Conference Proceedings (pp.1-6). Institute of Electrical and Electronics Engineers Inc. [10.1109/RTSI.2017.8065972].
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Utilizza questo identificativo per citare o creare un link a questo documento: http://hdl.handle.net/11590/403166
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