An innovative method for the ultrasonic measurement of piezoelectric micromachined ultrasonic transducers (pMUTs) using a laser microphone is presented. Full wafer mapping is achieved, allowing extensive statistical analysis of acoustic performance across many samples by automating the measurement process. This approach provides a valuable method for monitoring and improving device performance, as well as optimizing changes after the assembly phase and package mounting. The results demonstrate the effectiveness of our method for detailed acoustic characterization and provide valuable insights for the optimization and reliability assessment of pMUT devices.
Barretta, L., Scaldaferri, R., Savoia, A.S., Prelini, C.L., Lazzari, C.M., Koh, Y., et al. (2025). An In-Depth Acoustic Characterization Map at the Wafer Level Utilizing Advanced Optical Microphone. In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) (pp.1003-1006). Institute of Electrical and Electronics Engineers Inc. [10.1109/MEMS61431.2025.10917516].
An In-Depth Acoustic Characterization Map at the Wafer Level Utilizing Advanced Optical Microphone
Savoia A. S.;
2025-01-01
Abstract
An innovative method for the ultrasonic measurement of piezoelectric micromachined ultrasonic transducers (pMUTs) using a laser microphone is presented. Full wafer mapping is achieved, allowing extensive statistical analysis of acoustic performance across many samples by automating the measurement process. This approach provides a valuable method for monitoring and improving device performance, as well as optimizing changes after the assembly phase and package mounting. The results demonstrate the effectiveness of our method for detailed acoustic characterization and provide valuable insights for the optimization and reliability assessment of pMUT devices.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
